Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding

Product Details
Customization: Available
Metal Coating: Tin
Mode of Production: SMT
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  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
  • Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
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  • Overview
  • Product Description
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  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
MR30
Condition
New
Working Area
300mm×290mm
External Dimension
456mm×447mm×290mm
Frequency
50Hz
Cycle Time
2-10min
Temperature Range
Room Temperature~300°c
Transport Package
Package
Specification
The package size: 59x56x49CM
Trademark
Tronstol
Origin
Hangzhou
HS Code
851580909
Production Capacity
1000pieces/Year

Product Description

MR30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding small size
TronStol MR30 is the newest mini reflow oven.It is full convection oven(tubular heaters and fan).The heat distribution and absorption are same for dark and light components. After the reflow oven preheating, the temperature rise is about 1 ºC/S.It has a small size which is easy to transportation. It is mainly used for single-sided or double-sided PCB board soldering process requirements.

Features of Reflow Oven MR30

  • The product uses high-speed stability of the master MCU, with advanced intelligent temperature measurement and control technology, temperature measurement,temperature control fine.

  • The product has a temperature correction compensation function, reducing the use of the machine environment requirements, so that the machine in the temperature changes in the environment to maintain a stable temperature measurement quality.

  • The product has a constant temperature timer function, so that the machine to maintain a constant temperature environment to meet the diverse needs of users.

  • Upgraded version of the heat insulation device, so that the machine has a good heat dissipation function, to avoid short circuits caused by high temperature, and safer operation.

  • The product is equipped with the control software provides a variety of curve input, to facilitate the setting of a variety of curves.

  • The control software original graphics curve display module, real-time dynamic display curve, to achieve WYSIWYG, the abstract figures will be displayed to the user intuitively.

  • Control software to provide a variety of solder paste data, users can set the curve for reference.

Product Description
 Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB WeldingMr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
 
Related Production Lines

 

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding
Company Profile

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB WeldingMr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB WeldingMr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding

 
Exhibition

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding

 
Our Advantages

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding




 
Certificate

 

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding

 
Packaging & Shipping

 

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding



 
FAQ

Mr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB WeldingMr30 Lead Free SMD Hot Air SMT Reflow Soldering Oven for PCB Welding


 

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